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NX-620 High-Density SMT Interface Module
Nexelion Systems GmbHNo reviews yet — be the first to share your experience
RoHSISO 9001I2CSPIPCBSMT assemblysensor interface
High-density SMT interface module for compact multi-sensor data acquisition
About this product
A 6-layer high-density SMT module that consolidates analog and digital sensor inputs onto a single compact board for embedding inside instrumentation housings. Fine-pitch BGA assembly and ENIG finish support long-term solder joint reliability, while onboard I2C and SPI buses simplify integration with host microcontrollers.
Technical specifications
Component pitch0.4 mm BGA
Dimensions80 x 50 mm
FinishENIG
Layers6
Operating temp-10 to +60 °C
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